| 制程能力及检测参数 Process capability and checking parameters | ||||||||
| ITEM | Technical capabilities | |||||||
| 层次 Layers | 2-64layers | |||||||
| 最大尺寸 Max.Board Size | 1200mm*610mm | |||||||
| 79"*24" | ||||||||
| 板厚 Finished Board Thickness | 0.15mm--10.0mm | |||||||
| 0.01"--0.4" | ||||||||
| 铜厚 Finished?Copper?Thickness | 17um-420um | |||||||
| 0.5OZ--12OZ | ||||||||
| 最小线宽/线距 Min.Trace Width/Space | 0.075mm/0.065mm | |||||||
| 0.003"/0.0026" | ||||||||
| 最小孔径 Min.Hole Size | 0.1mm | |||||||
| 0.006" | ||||||||
| PTH孔孔径差 Hole Dim. Tolerance(PTH) | ±0.05mm | |||||||
| ±0.002" | ||||||||
| NPTH孔孔径差 Hole Dim.Tolerance(NPTH) | ±0.05mm | |||||||
| ±0.002" | ||||||||
| 孔位公差 Drill Location Tolerance | ±0.05mm | |||||||
| ±0.002" | ||||||||
| V-CUT角度 V-Score Degrees | 20-90度 | |||||||
| / | ||||||||
| 最小V-CUT板厚 Min.V-Score PCB Thickness | 0.25mm | |||||||
| 0.01" | ||||||||
| 外型公差 CNC Routing Tolerance | ±0.1mm | |||||||
| ±0.004" | ||||||||
| 最小盲/埋孔 Min.Blind/Buried Via | 0.1mm | |||||||
| 0.0039" | ||||||||
| 塞孔 Plug Hole Size | 0.2mm--0.5mm | |||||||
| 0.008"--0.02" | ||||||||
| 最小BGA Min.BGA PAD | 0.2mm | |||||||
| 0.008" | ||||||||
| 材质 Materials | FR4板（指定品牌物料：如建滔、生益、联茂、南亚、台光台耀等)、高频板、铁氟龙板、陶瓷板、罗杰斯板等等 | |||||||
| FR4 (designated brand materials: such as KB, Shengyi, ITEQ, NANYA, EMC,CENS and so on), high frequency board, Teflon board, ceramic board, Rogers board and so on | ||||||||
| 表面处理 Surface Finish | 沉金/防氧化/镀金 (软/硬) /喷锡/沉银沉锡/镀锡/碳油/金手指 | |||||||
| immersion gold/OSP/plating Gold (soft/hard) /hot air leveling (HASL)/immersion Silver/immersion Tin/plating Tin/Carbon ink/Gold-finger | ||||||||
| 翘曲度 Warp&Twist | ≤0.75% | |||||||
| 通断测试 Electrical Testing | 50--300V | |||||||
| 可焊性试验 Solderability Testing | 245±5℃,3sec Wetting area least95% | |||||||
| 热冲击试验 Thermal Cycling Testing | 288±5℃,10sec,3cycles | |||||||
| 离子污染测试 Ionic Contamination Testing | Pb,Hg,Cd,Cr(VI),PBB,PBDE六项均小等于1000ppm | |||||||
| Pb,Hg,Cd,Cr(VI),PBB,PBDE?six items are less than 1000ppm | ||||||||
| 附着力测试 Soldmask Adhesion?Testing | 260℃+/-5,10S，3times | |||||||
特殊工艺 Special Technology | 半孔、高Tg板、混合压板、无卤素板、超薄超厚板、邦定、阻抗、蓝胶、碳油、电厚金、镍钯金、金手指、盲锣、埋盲孔、沉头孔、树脂塞孔、软硬结合板、HDI等. | |||||||
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